The PCB Manufacturing Humidification Challenge
Dry Conditions Trigger ESD Events
During the PCB manufacturing process, machinery heats and dries the air, preventing static charges from dissipating correctly.
As a result, ESD buildup damages delicate electrical components. As long as dry air persists, electrical conductors, as well as the entire manufacturing process, are jeopardized.
Wet Conditions Distorts and Damages Products
But dry air isn’t the only threat. In excess or fluctuating humidity, conductive tracts distort, meaning humidity must be tightly controlled at all times.
From condensation to puddling, excess moisture threatens both the electrical products and the machinery that makes them.
The Self-Evaporative Solution
Stabilized Conditions Allow Seamless Productions
Eliminating the risks of ESD requires the perpetual saturation of non-fluctuating humidification. Self-evaporative technology uniquely solves this problem by diffusing self-repelling moisture that quickly spreads and stabilizes throughout the room.
There are no opportunities for ESD discharge to damage electrical components when self-evaporative humidification is included in the PCB manufacturing process.
Non-Wetting Humidity Eliminates Product Damage
Self-evaporative humidification also limits the damage caused by excess moisture. Because droplets self-repel and self-evaporate, puddles and condensation never get the chance to form.
In turn, well-saturated and stable conditions enable a more seamless manufacturing process.